Israa’iil: CoreFlow oo soo saartay xal cusub oo loogu talagalay qaybaha semiconductor-ka ee qalloocan

Yeruusaalem, 17 December, 2025 (TPS-IL) — Shirkadda Israa’iil ee qalabka semiconductor-ka ee CoreFlow ayaa soo bandhigtay marxalad cusub oo faakiyuum ah oo cabbirkeedu yahay 310 mm × 310 mm, taasoo loogu talagalay inay wax ka qabato qallooc weyn oo ka jira xirmooyinka chip-ka ee heerka panel-ka ee horumarsan. Nidaamku wuxuu bartilmaameedsanayaa wax soo saarka CoPoS (chip-on-panel-on-substrate), kaasoo bixiya meel aad u badan oo la isticmaali karo marka loo eego wefer-rada caadiga ah ee 300 mm, waxaana si sii kordheysa loogu isticmaalaa codsiyada ay ku shaqeyso AI. Nidaamkan, oo laga soo saaray xarunta CoreFlow iyo xarunta R&D ee Daliat-El Carmel, wuxuu u suurtageliyaa in si sax ah loo simo panel-lada qalloocan ee galaaska ah, wuxuuna la jaanqaadi karaa qalabka hadda jira ee cabbirka, lithography, iyo kormeerka. Alaabta hadda waa la dalban karaa, waxaana la filayaa in la keeno 8–12 toddobaad gudahood.